In the current AI and datacenter buildout, one of the key emerging constraints is the dissipation of heat from newer-generation chips and increasingly dense rack designs. Several technologies are being developed to address this rising heat load. One of the most promising is liquid cooling, which comes in multiple forms, including immersion cooling, single-phase cooling, and a newer approach known as dual-phase cooling. To our knowledge, INV is the only publicly traded company that provides direct exposure to this next generation of datacenter cooling technology. In addition, investors gain a majority stake in two other innovative companies, as well as…